Dichlorosilane
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Dichlorosilane, or DCS as it is commonly known, is a chemical compound with the formula H2SiCl2. In its major use, it is mixed with ammonia (NH3) in LPCVD chambers to grow silicon nitride in semiconductor processing. A higher concentration of DCS·NH3 (i.e. 16:1), usually results in lower stress nitride films.
Quick Facts Names, Identifiers ...
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Names | |||
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IUPAC name
Dichlorosilane[1] | |||
Other names
Silylene dichloride | |||
Identifiers | |||
3D model (JSmol) |
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Abbreviations | DCS[citation needed] | ||
ChemSpider |
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ECHA InfoCard | 100.021.717 | ||
EC Number |
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MeSH | dichlorosilane | ||
PubChem CID |
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RTECS number |
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UN number | 2189 | ||
CompTox Dashboard (EPA) |
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Properties | |||
SiH 2Cl 2 | |||
Molar mass | 101.007 g mol−1 | ||
Appearance | Colourless gas | ||
Density | 4.228 g cm−3 | ||
Melting point | −122 °C (−188 °F; 151 K) | ||
Boiling point | 8 °C; 46 °F; 281 K at 101 kPa | ||
Reacts | |||
Vapor pressure | 167.2 kPa (at 20 °C) | ||
Thermochemistry | |||
Std molar entropy (S⦵298) |
286.72 J K−1 mol−1 | ||
Std enthalpy of formation (ΔfH⦵298) |
−320.49 kJ mol−1 | ||
Hazards | |||
GHS labelling: | |||
Danger | |||
H220, H250, H280, H314, H330 | |||
P210, P261, P305+P351+P338, P310, P410+P403 | |||
NFPA 704 (fire diamond) | |||
Flash point | −37 °C (−35 °F; 236 K) | ||
55 °C (131 °F; 328 K)[2] | |||
Explosive limits | 4.1–99% | ||
Safety data sheet (SDS) | inchem.org | ||
Related compounds | |||
Related chlorosilanes |
Monochlorosilane Trichlorosilane | ||
Related compounds |
Dichloromethane | ||
Except where otherwise noted, data are given for materials in their standard state (at 25 °C [77 °F], 100 kPa).
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